Accepted in State of the CHI(art) workshop during CHI (ACM Conference on Human Factors in Computing Systems) 2022. It is now being compiled as a book with a DOI by the organizers of the workshop.

In Creativity and Cognition (C&C ’23), June 19–21, 2023, Virtual Event, USA. ACM, New York, NY, USA, 16 pages. https://doi.org/10.1145/3591196.3593433

Accepted at ID&A (Interaction Design and Architecture (s)) Journal 2022. https://doi.org/10.55612/s-5002-054-009

In TEI ’23: Proceedings of the Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction (TEI ’23), February 26-March 1, 2023, Warsaw, Poland. ACM, New York, NY, USA, 16 pages. https://doi.org/10.1145/3569009.3572744

Accepted in the 17th ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI). The paper will be available during the conference time in February 2023.

Accepted at the 3rd International Conference on the Challenges, Opportunities, Innovations and Applications in Electronic Textiles (E-Textiles 2021)